Apple looking to adopt what may be the next big thing in chip development: glass substrates

A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass substrates.

While that might not sound exciting, it offers the prospect of an entirely new way of mounting and packaging chips, which could offer much better thermal performance, allowing processors to run at maximum power for longer periods …

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